Electroplated nanotwinned Cu possesses excellent electrical & mechanical properties. It can be applied in three major joints:
1. Low thermal budget/ low resistance Cu bonding for high performance computing chip.
We are able to achieve low temperature bondinginstant bonding. Low temperature bonding is performed at 150°C for 1 h to achieve low contact resistance copper bonding. Instant bonding is performed at 300°C for 5 seconds under a pressure of 90MPa achieve low contact resistance.
2. High strength/ High ductility copper lines in 3D-IC packaging 
We are able to fabricate high strength foils with tensile strength of 800MPa. After annealing at 150°C for 3 hours, the foil retains a tensile strength of 750MPa. 3. Cu foils for lithium ion battery

We are able to DC electroplate highly (111) oriented nanotwinned copper filmsfabricate high strength/high conductivity/High toughness copper lines in 3D-IC packaging 
The tensile strength can be as high as 800MPa while maintaining reasonable ductility. After annealing at 150°C for 3 hours, the foil retains a tensile strength of 750MPa. This exhibits the ideal thermal stabilitytoughness ductility for 3D-IC application. In addition, with the Cu foils, the energy density can be increased.

Low temp Cu-Cu bonding appears to be the solution for next generation ultra-fine pitch packaging. Nanotwinned Cu lines can also be used as redistribution lines in 3D IC integration. This technology has drawn attention from TSMC, MediaTek, Applied Materials, LAM Research,we have projects with them to co-developed some applications. In addition, this technology also drawn attention from  the US

1.Cu-Cu bonding, fine pitch, low thermal budget, low resistance junction.
2.High electromigration resistancehigh strength Cu lines.
3.high strength nanotwinned Cu.