Proposed system is integrated by an automatic optical registration system, a linear arrayed probing device, a vacuum chamber and gas supply system, a validation system of gas concentration, a chuck table combined with heating device, and precisely positioning platform. The electrical features of wafer-based gas sensor chips can be measured efficiently to check each sensor quality in advance, and unqualified chips can be discarded to avoid them getting into the following packaging processes.

Proposed system is integrated by an automatic optical registration system, a linear arrayed probing device, a vacuum chamber and gas supply system, a validation system of gas concentration, a chuck table combined with heating device, and precisely positioning platform. The electrical features of wafer-based gas sensor chips can be checked in advance to avoid the unqualified chips getting into the packaging processes.

System equipment can provide the functionality and performance measurement for wafer-based gas sensors chips. The quality for each chip can be determined before packaging, and then the testing period for sensors development can be reduced substantially. Moreover, for production phase of gas sensors, the unqualified chips can be sieved out at wafer level to reduce the waste of packaging resources.