HEMC firstly developed high entropy superalloys with excellent corrosion resistancehigh temperature strength, which are far superior to commonly used stainless steelgreat candidates for catalyst bed materials of hybrid rocket engine. For rocket nozzle, NA-1NA-2 advanced refractory alloys are developed according to the combustion condition of the rocket engine with the technology for designing refractory high entropy alloysthermodynamics-assisted phase diagram simulation software, which are expected to meet the needs for domestic rocket development.

The low-temperature defect passivation technology developed by our team can effectively eliminate defects in materials under 250°C, and leads to the improvement of the performance and reliability of devices. The technology has demonstrated the significant performance improvement when applying on GaN-based devices. After the treatment, the conducting current of FET devices is increased with the same operation condition. Moreover, in terms of LED devices, the emission efficiency was enhanced and the forward operating voltage decreased as well.

As we know, most flowering devices are usually connected with a water pipe. when water goes through the pipeinto the flowering device, we can adjust the type of spray, especially when used for taking a shower. With technology keeping improving, we know that flowering devices have been designed to light

This multi-sensing system has pH range in 3 – 13temperature resistance of 2 Ω/°C. The conductivity part can clearly distinguish the conductivity of different liquids. This multi-sensor has good stabilitycan be applied to different water bodies in the future,combined with the cloud system, provides a intelligent detection methods.

The time-temperature indicator (TTI) developed by immobilizing laccase on electrospun fiber film with high specific surface area. The activation energycoloration of laccase TTI can be adjusted by pHaddition level of laccaseNaN3. This TTI exhibits high accuracy, stability, temperature reversibilitylow cost. The intelligent food packaging developed by this TTI can reduce the food wastethe food safety risk in traditional packaged foods.

The invention belongs to the field of low-temperature electrochemical graphitizationis improved by the FFC-Cambridge Process. In comparison to the traditional process, the invention can be at a low temperature of 850oCshorter process time. This strategy can convert carbon blacks into high-value graphite (graphene). The method is simple, low temperature, without adding catalyzer,low-cost. The products have a wide range of applications such as energy storage, catalysis, absorption, separation, processing metal cutter, precision die, aeronautics,astronautics.

A novel 3D-stack LTPO-based display array technology with CBRAM-embedded in a pixel has been successfully developed for the high-resolutionpower-saving near-eye VR/AR displays. Besides, a high-voltage gain CMOS inverter comprised by LTPO architecture is demonstrated acting as a digital driving circuit for the realistic FPD applications.

In this study, the recipe design, coupling technology, compounding technologyinjection molding integration is the know-how of this project, which can lead to the food containers of high temperature-resistanceimitation ceramic luster.

This technology develop a “Thermoelectric Ever-Charge Portable Charger” for the applications in auxiliary charging of consumer electronicsfast self-charging for outdoor sensors. Technically, a sputtering depositiona semiconductor photolithography technique are combined to fabricate p-n materialsconnection procedures. The thermoelectric performance of the device is further optimized through a low-temperature heat treatment.

This invention targets at value-added increase for fish bone/scale by-products through a series of manufacturing units of steaming, pressure/ temperature,drying. The core design of pressure/temperature in terms of powdered machining equipment consists of a high pressure chamber, heating components, superheated steam,operations experiments as well.

A Metal-Supported Solid Oxide Fuel Cell (MS-SOFC) unit cell with high electricity power output, stability, thermal-shock, mechanical-shock resistanceanti-redox abilities was successfully produced by a continuous fabrication process. This product can be installed not only in stationary SOFC power system but also in transportation set-up. The core technology of the fabrication process is Atmospheric Plasma Spraying (APS) technique which was employed to produce desired functional oxide lays onto permeable Nickel-base super alloy substrate.

The location of controlled-grain Si island is determined by the pattern of “cooling holes”. The grain size is determined by the distance between “holes” due to lateral grain growth using pulse laser crystallization. This predictability allows the transistorscircuits to stay away from the grain boundaries for monolithic

"NCU/GPSARC developed a 1DVAR RO data retrieval system, which retrieves the FORMOSAT-7 (FS7) RO refractivity to obtain atmospheric temperaturemoisture profiles. The high vertical resolution atmospheric soundings are comparable with radiosondes. The system is one of the components of the TROPS,it is operationally performed by CWB TACC. Based on Chen et al. (2020), we further apply the nonlocal RO operator with FS7 data in an advanced hybrid data assimilation system for the detection of tropical cyclogenesis. The processing systemdetection platform have been implemented at GPSARC."

Materials for power device packaging should endure high temperature, high voltage,high current density to handle various harsh working conditions. We developed Cu NP pasteCu/Sn paste for low temperature bonding technique. No toxic chemicals are present in the synthesis processin the pastes. The pastes can bond Cu substrates at low temperature without applying pressure. The joints possess high melting temperature, high thermal stabilityexcellent mechanical properties.

This technology is developedcontrolled by the National Central University, Central Weather BureauAcademic Sinica. The processing system is housed at NCUtechnical support is served in Taiwan to the global. The data is acquiredpreprocessed by CWB,followed by the invention of the cloud properties retrieval algorithm package by NCU. The final retrieval algorithm package is evaluatedenhanced by the local observation from Academic Sinica. Therefore, the processing system can be assured for its performancereliability. This state-of-the-art technology has been recognizedapproved by AGU JGR-Atmospheres, the leading journal in Q1 level of the related research community by the anonymous peer reviewing in June 2020.

A technique compatible to IC process has been presented to prepare gas sensing chips the lightly-doped region of nanoelectronic devices are grown with different sensing materials to form a gas sensor array. During gas sensing, individual nanodevice was Joule-heated, reducing power consumption to microWatts/device, solving the current high power consumption problem. With self-calibration of temperature, humidityinterfering gas, problems like cross-sensitivity, quantification, specificitysensitivity are solved. A demonstration of I+Nose with smart phone was presented for CO detection.

With rapid evolution of Moores lawsemiconductor technology nodes down to sub-10 nm, advanced devicematerial technologies capable of Å accuracy are highly demanded. Thus we developed atomic layer technologies including atomic layer deposition, atomic layer annealing, atomic layer epitaxy,atomic layer etching, etc. for extreme control of materialsstructures with Å precision.

On base of the advantages of dye-sensitized solar cells (DSSCs), including easy fabrication process, low cost,the high energy conversion efficiency under room light conditions, DSSCs were utilized as self-power suppliers for devices involved in internet-of-things (IoT) systems.

Electroplated nanotwinned Cu possesses excellent electrical & mechanical properties. It can be applied in three major joints: 1. Low thermal budget/ low resistance Cu bonding for high performance computing chip. We are able to achieve low temperature bondinginstant bonding. Low temperature bonding is performed at 150°C for 1 h to achieve low contact resistance copper bonding. Instant bonding is performed at 300°C for 5 seconds under a pressure of 90MPa achieve low contact resistance. 2. High strength/ High ductility copper lines in 3D-IC packaging We are able to fabricate high strength foils with tensile strength of 800MPa. After annealing at 150°C for 3 hours, the foil retains a tensile strength of 750MPa. 3. Cu foils for lithium ion battery