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    • 具高功因之全身垂直律動系統之研製

      FutureTech 具高功因之全身垂直律動系統之研製

      This technology develops a high-efficiency whole-body vertical vibration system, which includes a high-power factor correction circuit, a 2-switch forward converter, a full-bridge inverter realized by a micro-controller. The developed application products can generate alternating sine-wave waveform of different frequenciesamplitudes to the electromagnet coils to generate vertical vibration force, thereby achieving the effect of high power factoraccelerated motion. Different frequenciesamplitude voltages can achieve different vibration body positionvibration strength.
    • 自主巡航水下無人載具

      FutureTech 自主巡航水下無人載具

      The developed Unmanned autonomous underwater vehicles (AUV) included 3-D modeling technology, wireless power transfer between sub-system in AUV, GPS underwater locate system, low complexity frequency domain on ocean floor analyze with AI network, underwater objects detection network, image dehaze network on groundunder water, underwater color correction network, underwater objects classification network, underwater optical characteristic algorithmLED color compensation system.
    • AI深度壓縮工具鏈及混合定點數CNN運算加速器

      FutureTech AI深度壓縮工具鏈及混合定點數CNN運算加速器

      Assisted by in-house AI deep compression toolchain (ezLabel, ezModel, ezQUANT, ezHybrid-M), the proposed technology supports automatic AI model designoptimization with the integrated performance of 120x model size reduction70x power reduction in 2D CNN model,develops a world-first 1/2/4/8-bit CNN model realized by the developed high efficiency Hybrid fixed point CNN NPU (Hybrid-NPU), which has been verified in Xilinx ZCU102 FPGAachieves the performance up to 2.5 TOPS(8-b)/ 20TOPS(1-b)@28nm technology running at 550MHz4TOPS/W energy efficiency.
    • Wafer Level Probing System for Semiconductor Gas Sensor with High Throughput

      AI & IOT Application Innotech Expo Wafer Level Probing System for Semiconductor Gas Sensor with High Throughput

      This probing equipment is integrated by the opto-mechanical, electricalvacuum systematic technologies to efficiently measure the electric properties of gas sensor chips at wafer level. Therefore, we can identify the functionality of each sensor chip in early phasethen discard the unqualified chips to enhance the production efficiencyproducts competition.
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