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Technical category
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    • Vacuum Functional Coating Technology

      Electronic & Optoelectronics FutureTech Vacuum Functional Coating Technology

      Here we prepare a non-evaporative getter (NEG) film using magnetron sputtering. A vacuum chamber with a sputtered NEG film can maintain ultra-high vacuum (-10 Torr level) without any pump after activation. The activation temperature can be controlled below 200 °C according to different process conditions. The activated NEG film adsorbs residual gases in the vacuum system to achieve the UHV.
    • In-situ Large-scale X-ray Mirror Measurement Technology

      Electronic & Optoelectronics FutureTech In-situ Large-scale X-ray Mirror Measurement Technology

      The long trace profiler (LTP) can be used to measure the figureintermediate frequency roughness of an X-ray mirror. The measurement process is accurate, high-speednon-contact. The radius of curvature for the measurement may be ranged from a value from 5 m to infinity, such that the surface profile feature can be measured in the range with a longitudinal resolution of 0.15 nm.
    • Wafer Level Probing System for Semiconductor Gas Sensor with High Throughput

      AI & IOT Application Innotech Expo Wafer Level Probing System for Semiconductor Gas Sensor with High Throughput

      This probing equipment is integrated by the opto-mechanical, electricalvacuum systematic technologies to efficiently measure the electric properties of gas sensor chips at wafer level. Therefore, we can identify the functionality of each sensor chip in early phasethen discard the unqualified chips to enhance the production efficiencyproducts competition.
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