"The heat dissipation of electronic components becomes one of the most critical technologies for the developments of IoT, IoV,5G mobile communications. Implantation of heat dissipation components inside electronic products is of practice important to the 5G communication products today. Herein, we established: 1. High-speedpulse-reverse electroplating methods for the fabrication of heat dissipation components. 2. Microstructure modification of Cu interconnects for fine line technology5G high-frequency/-speed transmission interconnect design."