This technology develop a “Thermoelectric Ever-Charge Portable Charger” for the applications in auxiliary charging of consumer electronicsfast self-charging for outdoor sensors. Technically, a sputtering depositiona semiconductor photolithography technique are combined to fabricate p-n materialsconnection procedures. The thermoelectric performance of the device is further optimized through a low-temperature heat treatment.

Current 5G communication devices have a huge demand in high resolutiondensity of metal conducting wires in electronics ( 40 μm line width/line spacing), which cannot be achieved by conventional screen printing (100 μm). Our group cooperated with Ample Technology to develop a new-generation silver conductive paste which enables photolithographyachieves outstanding line resolution (5 μm width/13 μm spacing). The paste is simple to useperforms comparable of those of major European, AmericanJapanese manufacturers.

This research develops an innovative method for patterning arbitrarycomplicated 3D microstructures on metallic roller surfaces. This roller mold manufacturing system consists of digital light processing, arrayed microlensesoptical fibers,precision servo-controlled motion technologies. Based on this arrayed UV beam pen system, seamless roller molds are fabricated for roller imprintin

This technology proposes the preparation of Anodic Aluminum Oxide (AAO) templates on the surface of aluminum. The structural color of AAO is combined with lithography process to form patterns on the substrate, which can achieve high resolution on various aluminum substrate for decoration. Also, rewritable boardinvisible anti-counterfeiting technology are proposed for innovative applications by the low-cost, high-efficiency,high-saturation AAO structural colorpatterning.

This demonstration presents an active-matrix, 1920x1080, 370 nm UV MicroLED display. There are 2,073,600 pixels fabricated on this display which is smaller than a dollar coin,its diagonal has an extremely high pixel density of 3200 pixels per inch (ppi). The size of each pixel is 5 μm in diameter,the pixel pitch is 8 μm. The key technology of this achievement lies in the fabrication of pixels with good characteristicshigh uniformity,the successful development of flip-chip technology combining MicroLEDdriving integrated circuit pixels. This result can display imagesvideos.