The organic layerorganic-inorganic multi-layers deposited on the packaging substrate to achieve the ultra-high water barrier performance, lower than 10e-5 (g/m2/day). This technology can apply to all flexable electronic devices. The fabrication in this team evolved from batch-to-batch process in the 1st year to tray-to-tray process in the 3rd year. The roll-to-roll wet processin-line dry process are constructed in the 5th yearready for commercialization.