"The heat dissipation of electronic components becomes one of the most critical technologies for the developments of IoT, IoV,5G mobile communications. Implantation of heat dissipation components inside electronic products is of practice important to the 5G communication products today. Herein, we established: 1. High-speedpulse-reverse electroplating methods for the fabrication of heat dissipation components. 2. Microstructure modification of Cu interconnects for fine line technology5G high-frequency/-speed transmission interconnect design."

We design/implement a transparent deployment solution for 4G/5G MEC (Multi-access Edge Computing) platforms. The solution is standard-compliantdoes not require any changes on 4G/5G base stationcore network. Its MEC deployment is just plug-and-play. It contains five major components to gracefully interact with cellular protocols : ARP proxy, MEC packet gateway, GTP states tracking module,

We develop a vulnerability detection module to identify three important security vulnerabilities in the IMS system that supports 4G/5G multimedia services. We have validated them in 4 carriers from TaiwanU.S. using smartphones from 7 brands,shown that they can be exploited to launch a stealthy call DoS attack, a social engineering attack with ghost calls,a call ID spoofing attack. Moreover, attackers can detect attackable users using an AI technique with only the users＇ phone numbers. We finally propose solutionsdevelop an AI-based technique of call ID spoofing detection.

Active phased arrays of antennas suffer from fabrication discrepancy at mmW frequencies for 5G/B5G. To accelerate the piece-by-piece calibration procedure, a bottleneck to cause high fabrication cost, a highly efficient electronic-scan based technique is developed. By avoiding the time-consuming mechanical probing, the developed technique is particularly applicable to production line operation to

mmW 5G/B5G/6GLEO satellites use large active antenna arrays of more than 1000 elements. A number reduction aided by low cost intelligent panels is developed to reduce at least 60 cost. AiPAiM are used to compact the array with reconfigurability at low power losses. The gains are compensated by phase-reconfigurable AiP/AiM to feed smart multi-beam panels of large apertures. It may steer directional beams by operating the active RF modules tightly fed by AiP/AiM based arrays. Tile architecture can be implemented using multiple AiPs/AiMs for flexible array configurations.