進階篩選

Technical category
    • 創新壓迫性骨折治療技術-“脊固立”脊椎椎體復位強化系統

      FutureTech 創新壓迫性骨折治療技術-“脊固立”脊椎椎體復位強化系統

      “Tripod-Fix”, that is promising in every class of VCFmost importantly in wedge fracture is needed. “Tripod-Fix” made by titanium uses triangular pyramid-like design with three-dimensional expansion mechanism to increase stability against verticalhorizontal forces during placement. The advantages for Tripod-Fix treatment are to fix the angle of spine, stabilize the VB,insert the cement to avoid re-collapse. It is an effectivelow-risk restoration product for patients with VCF allowing a fastsustained improvement in quality of life.
    • 腎纖維化剋星 - NSC828779 候選藥物開發

      FutureTech 腎纖維化剋星 - NSC828779 候選藥物開發

      We have successfully synthesized NSC828779, a new salicylanilide derivative,demonstrated that this new compound bears high efficiencylow toxicity on: [1] inhibiting renal fibrosismononuclear leukocytes infiltration[2] inhibiting IL-36α signaling, on renal fibrosis in a mouse renal fibrosis model. Importantly, we also owned [1] three approved material patents (US 8975255 B2 US 9162993 B2 I454445, Taiwan) [2] two indication patents [US 17/308,67, USPTO, USA,T2393-TW, NDMC, Taiwan, submitted) under review [3] technology transfer to Encommelt Medical Sciences llc.
    • 緊急醫療數位轉型_跨部會一站整合

      FutureTech 緊急醫療數位轉型_跨部會一站整合

      "The digital transformation of emergency medical is a inter-agency standard of data bridging, which integrates the 119 fire dispatching materials, fire rescue records, ambulance driving data, patient tracking (patient vital characteristics data), emergency medical resources, patient care process. We use NATs (The Cloud Native Message System) technology to achieve early warning mechanism that deliver on-site patient information to the hospital, including: patient's vital signs, type of acutesevere illness, etc. We think it cloud enhance the early prevention measures at hospital."
    • A Transparent Deployment Solution for 4G/5G Edge Computing Platform

      Electronic & Optoelectronics FutureTech A Transparent Deployment Solution for 4G/5G Edge Computing Platform

      We design/implement a transparent deployment solution for 4G/5G MEC (Multi-access Edge Computing) platforms. The solution is standard-compliantdoes not require any changes on 4G/5G base stationcore network. Its MEC deployment is just plug-and-play. It contains five major components to gracefully interact with cellular protocols : ARP proxy, MEC packet gateway, GTP states tracking module,
    • 自我網路架構搜尋與注意力機制之肺部電腦斷層掃描結節輔助診斷系統

      FutureTech 自我網路架構搜尋與注意力機制之肺部電腦斷層掃描結節輔助診斷系統

      Similar to the critical point tracking technology of human vision, the split attentionspatial grouping enhancement module, combining the multi-path grouping architecturespatial attention technology, can accurately extract important information from the imageimprove the network performance. Moreover, adopting neural architecture search technology to automatically search for the most suitable network architecture based on current moduleshardware devices can balance diagnosis speedhigh accuracy.
    • 國產火箭引擎用先進高熵合金的研究與開發

      FutureTech 國產火箭引擎用先進高熵合金的研究與開發

      HEMC firstly developed high entropy superalloys with excellent corrosion resistancehigh temperature strength, which are far superior to commonly used stainless steelgreat candidates for catalyst bed materials of hybrid rocket engine. For rocket nozzle, NA-1NA-2 advanced refractory alloys are developed according to the combustion condition of the rocket engine with the technology for designing refractory high entropy alloysthermodynamics-assisted phase diagram simulation software, which are expected to meet the needs for domestic rocket development.
    • Broadband Ocean Bottom Seismometer (BBOBS)

      Smart machinerynovel materials FutureTech Broadband Ocean Bottom Seismometer (BBOBS)

      The Broadband Ocean Bottom Seismometer(BBOBS) is a marine instrument that collects natural earthquakesartificial sound sources. BBOBS project has been leading by TORI, Academic Sinica,National Sun Yat-Sen University from designing, testing to success. BBOBS have been deployedrecovered in several research cruisesobtained the great results.
    • 新世代輕量高性能異構組織中熵合金

      FutureTech 新世代輕量高性能異構組織中熵合金

      Novel alloys are composed of five special technologies (1)Development of CALPHAD phase diagram for medium entropy alloys(2)Development of novel lightweight Ti-rich medium entropy alloys with high strengthhigh ductility (YS 950 MPa, TS 1200 MPaEL 30)(3)Heterogeneous structures obtained by the thermomechanical treatment an rapid annealing treatment(4)Tailoring the heterogeneous structures to enhance the mechanical properties (YS 1240 MPa, TS 1510 MPa, 250 MPa·cm3/ga nd EL 25)(5)Commercial productions are produced by these large dimension alloys for further industrial application.
    • The Application of Intelligent Agricultural Control System on Orchard

      AI & IOT Application FutureTech The Application of Intelligent Agricultural Control System on Orchard

      This project integrated with industrial foresight technologies, including UAV, artificial intelligenceimage recognition, to collect real-time images, apply algorithm in evaluation, link the technology of IOT (Internet of Things)environment sensing,use unmanned vehicle to conduct controlling work.
    • 順應式同步多頻率擴散光學斷層造影系統

      FutureTech 順應式同步多頻率擴散光學斷層造影系統

      This breaking-through technology aims at designingconstructing a compliant prone-type ring-scanning inspection platform incorporated with a simultaneous multi-frequency driving NIR light source to complete a diffuse optical imaging system. The realized system has two features superior to other counterpart imaging equipments: (i) compliant flexible optical channels to collect optical information,(ii) simultaneous multiple frequency driving light source. It brings the benefits to improve the accuracy of reconstructed imagesshorten examination time for test subjects.
    • Wafer Level Probing System for Semiconductor Gas Sensor with High Throughput

      AI & IOT Application Innotech Expo Wafer Level Probing System for Semiconductor Gas Sensor with High Throughput

      This probing equipment is integrated by the opto-mechanical, electricalvacuum systematic technologies to efficiently measure the electric properties of gas sensor chips at wafer level. Therefore, we can identify the functionality of each sensor chip in early phasethen discard the unqualified chips to enhance the production efficiencyproducts competition.
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