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    • 高質化石墨烯晶圓於下世代半導體之磊晶應用

      FutureTech 高質化石墨烯晶圓於下世代半導體之磊晶應用

      In this technique, it can synthesize high-qualitylarge area graphene. We develop batch to batch chemical vapor deposition (B2B-CVD) to reduce the cost to facilitate the industrialized production. At the same time, the development of high-quality six-inch graphene silicon wafers was made with our unique transferring process. The wafer can be used as epitaxial substrates, which can solve the bottleneck of poor heat dissipation of sapphire substrates, lattice mismatch of Si substrates,expensive SiCGaN substrates.
    • 具高功因之全身垂直律動系統之研製

      FutureTech 具高功因之全身垂直律動系統之研製

      This technology develops a high-efficiency whole-body vertical vibration system, which includes a high-power factor correction circuit, a 2-switch forward converter, a full-bridge inverter realized by a micro-controller. The developed application products can generate alternating sine-wave waveform of different frequenciesamplitudes to the electromagnet coils to generate vertical vibration force, thereby achieving the effect of high power factoraccelerated motion. Different frequenciesamplitude voltages can achieve different vibration body positionvibration strength.
    • 應用第三代半導體之高功率密度先進電源

      FutureTech 應用第三代半導體之高功率密度先進電源

      The research topics include advanced power supply, energy storage techniques, electromechanical integration, electric vehicles,power system control. Based on the existing researchdevelopment foundation, focusing on energy conversion efficiency, high-voltage charging (fast charging), device miniaturizationlight weight, smart power management solutions, etc., with lightweight materials. Develop a power management solution to instantly monitor the power statuscharging device. The application of management to achieve the vision of a smart city.
    • Platform for SiC Power System on a Chip

      Electronic & Optoelectronics FutureTech Platform for SiC Power System on a Chip

      Develop a SiC single-chip power system platform across processes, devices,circuits to breakthrough the temperaturepower constraints of Si applications. The research includes low-voltage CMOS logic circuits, high-voltage driver circuits,vertical super-junction MOSFETs. All specifications exceed existing technology. The results can be applied to energy networks, rail transit, new energy vehicles, geological exploration, aerospace, defenseother fields.
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