"The heat dissipation of electronic components becomes one of the most critical technologies for the developments of IoT, IoV,5G mobile communications. Implantation of heat dissipation components inside electronic products is of practice important to the 5G communication products today. Herein, we established: 1. High-speedpulse-reverse electroplating methods for the fabrication of heat dissipation components. 2. Microstructure modification of Cu interconnects for fine line technology5G high-frequency/-speed transmission interconnect design."

In this invention, the fluorinated graphene(FG) is obtained by the fluorination of electrochemically exfoliated graphene (ECG), which is found to be a one-step approach for the scalable preparation of FG. The precursor with fluorine atoms is mixed with the ECG followed by applying lower energy to produce the fluorinated graphene. This process demonstrates an eco-friend and safe as well as scalable features. We have demonstrated their multi-functional applications on surface coatings, including the outperformance anticorrosion passivation, hydrophobic surface with ultra-strong adhesion, and high safety energy storage device. This technology provided a new strategy for next-generation functional and atomic layered coatings.