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Technical category
    • Mass production technology of fluorinated graphene and its multi-functional applications on surface coating

      Smart machinerynovel materials FutureTech Mass production technology of fluorinated graphene and its multi-functional applications on surface coating

      In this invention, the fluorinated graphene(FG) is obtained by the fluorination of electrochemically exfoliated graphene (ECG), which is found to be a one-step approach for the scalable preparation of FG. The precursor with fluorine atoms is mixed with the ECG followed by applying lower energy to produce the fluorinated graphene. This process demonstrates an eco-friend and safe as well as scalable features. We have demonstrated their multi-functional applications on surface coatings, including the outperformance anticorrosion passivation, hydrophobic surface with ultra-strong adhesion, and high safety energy storage device. This technology provided a new strategy for next-generation functional and atomic layered coatings.
    • Innovative Wireless PositioningTracking System

      Electronic & Optoelectronics FutureTech Innovative Wireless PositioningTracking System

      iTech has developed an Innovative Wireless Positioning&Tracking System. iShield can simultaneously detect drones & operators. iPosition tracks thousands of targets indoor. iFollow is an auto-following function for smart droids.
    • 快速檢測磷酸根之離子選擇性感測晶片

      FutureTech 快速檢測磷酸根之離子選擇性感測晶片

      A phosphate-sensing chip was constructed by a copper phosphate-deposited electrode. The modification of ionic liquidplasticizer can improve the selectivity of phosphate anionsreduce the interference of sulfate, nitratechloride anions. The sensing chip equipped with a portable electrochemical device can directly detect the phosphate concentration of solution extracted from soil samples in ten minutes by using amperometry. The sensing chip promises the feasibility of detecting the phosphate concentration without expensive instrumentlabor-intensively chemical colorimetry.
    • 紡織品柔性電路製程及穿戴聯網技術

      FutureTech 紡織品柔性電路製程及穿戴聯網技術

      "The SPC process technology developed by our team has a patented cloth surface treatmentmultiple layers of conductive circuit layers (Layout) without etchingtransfer printing processes. It can not only be continuously automated production (piece to piece), but also Environmental protection, in line with the green trend of cleaner production. Features: 1. E-textiles 2. Twistable 3. Folded (0-180 degree angle) 4. Cleaning 5. Customized"
    • 電子式斷路器

      FutureTech 電子式斷路器

      "1. The modular design of a electric breaker is proposed. A prototype of a solid-state circuit with an input voltage of 500 Vadjustable rated current including 50 A, 100 A, 150 A200 A. 2. Achieved zero-current cutoff within 110 µs using the characteristics of IGBTs to detect the current value. 3. A12 bits analog/digital converter is used to achieve a higher accuracy current detection effect when compared with the conventional analog circuit. It can also detect the fault current rising ratecorrespond to different protection delay times according to the different fault current rising rate, so that the components in the solid-state breaker can withstand a lower fault current."
    • Embedded Smart Textile Arrays Display Module

      Electronic & Optoelectronics FutureTech Embedded Smart Textile Arrays Display Module

      National Taipei University of Technology (NTUT) announces the latest approach“embedded smart textiles arrays display module” (ESTAD module) . The ESTAD module involves twoparts,one is circuitthe other is control box. The circuit is to attach the fabric seamlessly,this could be twistedrubbed to fit various design. The control box is designed smaller than the current form to put in the pocketsomewhere hidden in the potential application.
    • Platform for SiC Power System on a Chip

      Electronic & Optoelectronics FutureTech Platform for SiC Power System on a Chip

      Develop a SiC single-chip power system platform across processes, devices,circuits to breakthrough the temperaturepower constraints of Si applications. The research includes low-voltage CMOS logic circuits, high-voltage driver circuits,vertical super-junction MOSFETs. All specifications exceed existing technology. The results can be applied to energy networks, rail transit, new energy vehicles, geological exploration, aerospace, defenseother fields.
    • GaN Based High-frequency High-efficiency Converter

      Electronic & Optoelectronics FutureTech GaN Based High-frequency High-efficiency Converter

      A high power converter application built with GaN HEMT was presented. The technical aspects are developed from 6-inch wafers to converter applications, covering the optimization of 6-inch GaN epitaxial layers. The processdevice model of the 6-inch GaN E/D-mode component was established. Low-side GaN HEMT logic gates ( 2MHz) for integrated circuit were designed. Finally, The high-frequency LLC resonant converter is completed.
    • High-Security IC Test Technology with Dynamic Keys

      Electronic & Optoelectronics FutureTech High-Security IC Test Technology with Dynamic Keys

      We proposed a dynamic-key secure DFT structure that can generate the keys dynamicallydefend scan-basedmemory attacks without decreasing the system performancethe testability. Analysis results show that our method can achieve a very high security levelthe security level will not decrease no matter how many times the attacker guesses due to the dynamic characteristic of our method.
    • 適用於次世代定序識別基因變體之系統晶片

      FutureTech 適用於次世代定序識別基因變體之系統晶片

      This research presents a genetic variant discovery SoC for analyzing Next-generation sequencing data which is embedded with the processorconnected with some peripherals. With hardware-optimized algorithm sBWT, we greatly speed up the process of short reads mapping by k-ordered FM-indexsuffix grouping. After short reads mapping, we utilized de bruijn graph for sequence assembly to rebuild haplotypes,built haplotypes are compared to the reference genome to detect genome variations. The detected variations are written to files for further clinical diagnosisresearch analysis.
    • 高解析度光學微影銀漿

      FutureTech 高解析度光學微影銀漿

      Current 5G communication devices have a huge demand in high resolutiondensity of metal conducting wires in electronics ( 40 μm line width/line spacing), which cannot be achieved by conventional screen printing (100 μm). Our group cooperated with Ample Technology to develop a new-generation silver conductive paste which enables photolithographyachieves outstanding line resolution (5 μm width/13 μm spacing). The paste is simple to useperforms comparable of those of major European, AmericanJapanese manufacturers.
    • 以二維材料為基礎的ppb等級氣體偵測器

      FutureTech 以二維材料為基礎的ppb等級氣體偵測器

      Based on the mass production technique to fabricate 2D materials developed by our group, efficient gas sensors against NOx with sensitivity of 100 ppb are successfully demonstrated. In comparison to international competitors, our products exhibit superior sensitivityselectivity. Furthermore, the technique would be extended to other 2D materials to fabricate various gas sensors against multiple target gases. The integration with internet of things would then open new feasibilities for early monitoring in environmental pollutionhuman safety.
    • Filter componentsbandpass filtering circuit of bandpass filter

      Electronic & Optoelectronics Innotech Expo Filter componentsbandpass filtering circuit of bandpass filter

      An equivalent LC model is developed to emulate the filter performanceto accelerate the design procedure. The source-load coupling renders this filter a cross-coupling effect which creates two transmission zeros by the passband edges for the signal selectivity enhancement.
    • Balanced bandpass filter design using the folded substrate integrated waveguide

      Electronic & Optoelectronics Innotech Expo Balanced bandpass filter design using the folded substrate integrated waveguide

      A novel balanced BPF using the folded half-mode substrate integrated waveguide has a central frequency of 4.65 GHz with 0.55 GHz BWin-band insertion loss of 2.2 dB. The size of an FHMSIW is about 1/4 of the substrate integrated waveguide (SIW). The common-mode rejection levels are greater than 40 dB over a wide frequency range.
    • Vehicle LiDAR using CMOS Single-photon Detectors

      Smart machinerynovel materials FutureTech Vehicle LiDAR using CMOS Single-photon Detectors

      This project is used for advanced driver assistance systems (ADAS)automatic driving. At present, our project will use a more sensitive CMOS single photon detector array to reduce the number of photons required for detection to less than ten, in order to break through the cost barriers of applications of LiDARestablish low-cost, high-performance LiDAR modules.
    • The Development of Lead-Free Piezoelectric MEMS Triaxial Accelerometer System for Safety Monitoring of Unmanned Vehicles

      FutureTech The Development of Lead-Free Piezoelectric MEMS Triaxial Accelerometer System for Safety Monitoring of Unmanned Vehicles

      "The team established material doping technology to greatly improve the piezoelectric properties of lead-free materials,successfully prepared MEMS lead-free triaxial piezoelectric accelerometers. The use of lead-free materials is the world's first development result. In addition, the team also integrated sensors, back-end circuitsuser interfaces, applied the acceleration gauge system to the safety monitoring of unmanned vehicles,successfully integrated the intelligent integrated sensingcontrol system required in the Internet of Things era."
    • 基於深度學習的光刻電路失真預測,光罩修正及新穎布局圖樣偵測的設計自動化技術

      FutureTech 基於深度學習的光刻電路失真預測,光罩修正及新穎布局圖樣偵測的設計自動化技術

      The DNN models of this technology include a LithoNet, an OPCNet,a layout novelty detection network. LithoNet is a learning-based pre-simulation model for layout-to-SEM contour prediction,OPCnet is a dual network of LithoNet for photomask optimization. Integrated with a well-trained LithoNet, our layout novelty detection network, consisting of a self-attention guided LithoNetan autoencoder, can check if there are layout patterns easily resulting in local distortions in contours of metal lines based on multi-modal (global-local) feature fusion.
    • 高解析度紫外光微型發光二極體顯示器

      FutureTech 高解析度紫外光微型發光二極體顯示器

      This demonstration presents an active-matrix, 1920x1080, 370 nm UV MicroLED display. There are 2,073,600 pixels fabricated on this display which is smaller than a dollar coin,its diagonal has an extremely high pixel density of 3200 pixels per inch (ppi). The size of each pixel is 5 μm in diameter,the pixel pitch is 8 μm. The key technology of this achievement lies in the fabrication of pixels with good characteristicshigh uniformity,the successful development of flip-chip technology combining MicroLEDdriving integrated circuit pixels. This result can display imagesvideos.
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