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Technical category
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    • 廢棄物回收碳轉化高價值石墨(烯)奈米粉體技術

      FutureTech 廢棄物回收碳轉化高價值石墨(烯)奈米粉體技術

      The invention belongs to the field of low-temperature electrochemical graphitizationis improved by the FFC-Cambridge Process. In comparison to the traditional process, the invention can be at a low temperature of 850oCshorter process time. This strategy can convert carbon blacks into high-value graphite (graphene). The method is simple, low temperature, without adding catalyzer,low-cost. The products have a wide range of applications such as energy storage, catalysis, absorption, separation, processing metal cutter, precision die, aeronautics,astronautics.
    • 微電漿系統製程三維孔洞奈米材於紙基材應用於高產氫、高靈敏性拉曼、高催化

      FutureTech 微電漿系統製程三維孔洞奈米材於紙基材應用於高產氫、高靈敏性拉曼、高催化

      Here we developed a fastgreen process of micro-plasma system for three-dimensional porous nanomaterials on low-cost paper substrates. The characteristics are low-cost, flexible,high-stability. It has three major applications, including increasing Raman measument, the detection process can be used with portable Raman spectroscopy for fast sensing,it can quickly analyze pesticides, food, drugs, etc. In addition, it can be equipped with boron nitride for high hydrogen productionhigh pollution biodegradationother applications.
    • 低溫常壓銅接合技術之開發

      FutureTech 低溫常壓銅接合技術之開發

      Materials for power device packaging should endure high temperature, high voltage,high current density to handle various harsh working conditions. We developed Cu NP pasteCu/Sn paste for low temperature bonding technique. No toxic chemicals are present in the synthesis processin the pastes. The pastes can bond Cu substrates at low temperature without applying pressure. The joints possess high melting temperature, high thermal stabilityexcellent mechanical properties.
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