The organic layerorganic-inorganic multi-layers deposited on the packaging substrate to achieve the ultra-high water barrier performance, lower than 10e-5 (g/m2/day). This technology can apply to all flexable electronic devices. The fabrication in this team evolved from batch-to-batch process in the 1st year to tray-to-tray process in the 3rd year. The roll-to-roll wet processin-line dry process are constructed in the 5th yearready for commercialization.

Our team used Chemical Vapor Deposition to create a multi-functional polymer coating, which is an extremely densenano-level parylene film. Using the vapor deposition encapsulation technology, the liquid droplet is encapsulated in the parylene film. This new type of intraocular lens, which mimics real human lens, can achieve the ability of ciliary muscle accommodation, moreover, has the characteristics of " optical properties""biological properties ".

Oscillator is a very important device of significant components in electronic products. This invent proposes a new method for calibrating oscillator frequency. By this technique, the oscillator product using this invent can output the frequency of clock signal flexibly from 1MHz to 200MHz through a programmer setting. This invent is the first low-cost oscillator control chip in the world that can set the frequency of output clock signal. In addition, this invent developed the smallest package 20x16 mm2 oscillator for next-generation consumer electronics in the world.

"PressureDOT team will develop the first intra-abdominal pressure monitoringlocalization micro internet device of things, to integrate into critical care vital sign monitoring systemtake care of the critical patients. This will ensure our role in the marketset up market barrier in this type of medical devices. With this platform, we can collect the continuous physical signal from c

Electroplated nanotwinned Cu possesses excellent electrical & mechanical properties. It can be applied in three major joints: 1. Low thermal budget/ low resistance Cu bonding for high performance computing chip. We are able to achieve low temperature bondinginstant bonding. Low temperature bonding is performed at 150°C for 1 h to achieve low contact resistance copper bonding. Instant bonding is performed at 300°C for 5 seconds under a pressure of 90MPa achieve low contact resistance. 2. High strength/ High ductility copper lines in 3D-IC packaging We are able to fabricate high strength foils with tensile strength of 800MPa. After annealing at 150°C for 3 hours, the foil retains a tensile strength of 750MPa. 3. Cu foils for lithium ion battery

Our team has developed technology to build lung-on-a-chip with the aim of creating alternatives for animal researchachieving more accuratereliable preclinical experimental data.The chip＇s rapideffective screening ability will help the clinical community to reduce costsdrastically shorten the drug-development process.

Materials for power device packaging should endure high temperature, high voltage,high current density to handle various harsh working conditions. We developed Cu NP pasteCu/Sn paste for low temperature bonding technique. No toxic chemicals are present in the synthesis processin the pastes. The pastes can bond Cu substrates at low temperature without applying pressure. The joints possess high melting temperature, high thermal stabilityexcellent mechanical properties.

mmW 5G/B5G/6GLEO satellites use large active antenna arrays of more than 1000 elements. A number reduction aided by low cost intelligent panels is developed to reduce at least 60 cost. AiPAiM are used to compact the array with reconfigurability at low power losses. The gains are compensated by phase-reconfigurable AiP/AiM to feed smart multi-beam panels of large apertures. It may steer directional beams by operating the active RF modules tightly fed by AiP/AiM based arrays. Tile architecture can be implemented using multiple AiPs/AiMs for flexible array configurations.

首創(a)超薄型毫米波雙極化寬頻天線，較過去成果具厚度優勢(b)3D雙曲面空腔結構增加垂直貼片天線頻寬，較過去具頻寬優勢(c)毫米波多功能RFIC整合技術，大幅降低封測廠毫米波RFIC自動測試方案成本及(d)低變異量頻率可重置之寬頻切換式相移器，大幅切換頻帶時仍維持低振幅與相位變異量。