進階篩選

Technical category
    • Application of inorganic nanofiber technology to promote the development of biotechnology

      Smart machinerynovel materials FutureTech Application of inorganic nanofiber technology to promote the development of biotechnology

      Inorganic porous nanofibers with surfaceinterface defects are prepared through humidity-controlled electrospinninghigh-temperature annealing technology. Under the irradiation of light sources of different wavelengths (380~780 nm), the bound electrons stored in the valence band can be excited to the conduction band to form free electrons on the surface of the material, generating different intensities of microcurrents, light sensitivitymicrocurrent changes. Because the "inorganic nanofiber" technology has high uniquenesshigh product compatibility, it can be applied to a wide range of markets.
    • (test)Application of inorganic nanofiber technology to promote the development of biotechnology

      Smart machinerynovel materials FutureTech (test)Application of inorganic nanofiber technology to promote the development of biotechnology

      Inorganic porous nanofibers with surfaceinterface defects are prepared through humidity-controlled electrospinninghigh-temperature annealing technology. Under the irradiation of light sources of different wavelengths (380~780 nm), the bound electrons stored in the valence band can be excited to the conduction band to form free electrons on the surface of the material, generating different intensities of microcurrents, light sensitivitymicrocurrent changes. Because the "inorganic nanofiber" technology has high uniquenesshigh product compatibility, it can be applied to a wide range of markets.
    • Low temperature instant copper bondinghigh toughness/low resistance  RDL lines using 111 nanotwinned copper linesfoils

      FutureTech Low temperature instant copper bondinghigh toughness/low resistance RDL lines using 111 nanotwinned copper linesfoils

      Electroplated nanotwinned Cu possesses excellent electrical & mechanical properties. It can be applied in three major joints: 1. Low thermal budget/ low resistance Cu bonding for high performance computing chip. We are able to achieve low temperature bondinginstant bonding. Low temperature bonding is performed at 150°C for 1 h to achieve low contact resistance copper bonding. Instant bonding is performed at 300°C for 5 seconds under a pressure of 90MPa achieve low contact resistance. 2. High strength/ High ductility copper lines in 3D-IC packaging We are able to fabricate high strength foils with tensile strength of 800MPa. After annealing at 150°C for 3 hours, the foil retains a tensile strength of 750MPa. 3. Cu foils for lithium ion battery