化學氧化

Inorganic porous nanofibers with surfaceinterface defects are prepared through humidity-controlled electrospinninghigh-temperature annealing technology. Under the irradiation of light sources of different wavelengths (380~780 nm), the bound electrons stored in the valence band can be excited to the conduction band to form free electrons on the surface of the material, generating different intensities of microcurrents, light sensitivitymicrocurrent changes. Because the "inorganic nanofiber" technology has high uniquenesshigh product compatibility, it can be applied to a wide range of markets.

NCREE has originally developed 5D digital space—on the basis of 3D city modelsconnections of different kinds of sensors around the world— is an online to offline virtual space with a combination of rising 5G technology advantages. Collectingreorganizing various 3D cartographic data with Building Information Modeling (BIM), satellite imagery, UAV 3D modeling, LiDar point cloud data, etc., can increase the diversity of the buildinglandscape. 5D+5G smart city platform would accelerate the 5D smart city to become the digital twin of a real city.

1. CNN model architecture optimization techniques: Propose an Agilev3-L architecture, with a performance index of mAP@50:95FPS:FP16 up to 171.79 2. GOP-mode acceleration scheme for real time inference: employ GOP-modeTRACKING algorithms to enhance the processing rate. 3. Propose a rapid data labeling system HiTag.

The developed innovativegreen electrolyzed catalysis (EC) system can generate high concentrations of hydroxyl radical (OH·)nanobubbles, which can remediate TPH-contaminated soilgroundwater effectivelyeconomically. The EC system applies high voltagehigh electric fielduses direct current to change the structure of water molecular. Under activities of high voltagecatalystselectrolysis reactions, the electric discharges can produce EC water containing ·OH for TPH oxidation without secondary pollution. Nanobubbles can produce ·OH continuously after bursting.

Materials for power device packaging should endure high temperature, high voltage,high current density to handle various harsh working conditions. We developed Cu NP pasteCu/Sn paste for low temperature bonding technique. No toxic chemicals are present in the synthesis processin the pastes. The pastes can bond Cu substrates at low temperature without applying pressure. The joints possess high melting temperature, high thermal stabilityexcellent mechanical properties.