Through combining thermo-sensitivelaser-sensitive materials, pattern designs,mechanism designs of adhesives as well, we are the first to develop a dry patch that can initiate fast adhesion responses under laser irradiation. It has the characteristics of residue-free, high adhesion,easy peeling, being suitable for somewhere needed controllable adhesions,can be applied to wetrough object surfaces. The advantage of rapid response is very suitable for temporary fixationassembly handling of waferchip processing,can be used in semiconductor manufacturing, electronic assembly,optoelectronics process, etc.

We developed the first adhesive that uses laser to change the physical properties of the adhesive layer surfaces,can rapidly respond to adhesion force. Using laser-sensitivethermo-sensitive materials, coupled with patternmechanism designs, it can Instantly attain the melting of the adhesive surfaces,achieve the glassy temperatures under laser irradiation within a few seconds. The adhesionelastic modulus of the layers have a gained difference, as coupled with the micro-suction cup design, so that the adhesion of the patch can be controlled arbitrarily, showing great application potential for high-tech industrial processing.

The laser-sensitivethermo-sensitive materials developed by this technology, coupled with patternmechanical structures, can enhance the effect of pull-off adhesion on temperature,the effect of the pattern, displaying in the applications of planar die transfer (such as mass transfer in µLED ), micro-devices in 2.5D IC packagingin 3D advanced packagingnon-planar chip arrangement protection by better adhesion area. It can also be used in vacuum deposition for optoelectronic glass,in transfer printing of flexible electronic microcircuitsother purposes.