We design an elastic and self-healing semiconductor polymer with simple preparation. Utilizing the hydrophilic and hydrophobic properties of the polymer and the characteristics of the horizontal water plane to develop the technique of making perfect contact for the broken semiconductor nano-film to achieve self-healing behavior.
Briefly described as follows:
1.First, we prepare water-soluble polymer material on the substrate by spin coating to form a sacrificial layer (2 pieces).
2.Second, by using the same method, the developed elastic and self-healing semiconductor polymer was then coated on the sacrificial layer (2 pieces).
3.After first and second steps complete, we place the substrate on the water to dissolve the sacrificial layer, therefore, the separated semiconductor films can be obtained.
4.Connecting two pieces of semiconductor films, where place on the same horizontal surface, through physical contact to achieve self-healing behavior.

In the past, self-healing materials are presented in bulk sample, but electronic components usually operate under nano-level dimensions. Although the bulk material can heal itself after damages, it is still difficult to apply in electronic components since it needs additional treatments to achieve self-healing behavior by thermal annealing or solvent annealing that often cost a long time to heal. In this technique, we break through the limitation of bulk sample and successfully employ physical contact for the semiconductor nanofilm on the horizontal surface that the thin films can self-heal at room temperature within 2 seconds. Furthermore, this semiconductor polymer can sustain both mechanical and electronic properties after 500 stretching cycles test.

Flexible electronic products are the future trend; however, the flexible semiconductor cannot recover its performance due to the damages after repeated stretching cycles. Thus, we develop the elastic and self-healable semiconductor material in nano-dimension and it has been verified that can self-heal at room temperature within few seconds. It allows the flexible electronics can heal and maintain the performance that extent the utilization of devices.