A simple and robust novel micro inductive tactile sensor is proposed. The footprint of sensing chip is below 2mm, which can be easily integrated. The tactile sensor is implemented by the commercially available standard CMOS process, no customized fabrication processes are required. Thus, it is ready for mass production after concept proven.

感測晶片製作使用標準CMOS製程，無須客製化製程
電感式感測，無懸浮薄膜結構，具優越之製程良率和可靠度
電感式感測，無懸浮薄膜結構，可承受較大的過載施力
具批量製造量產之可行性
晶片級微型觸覺感測器容易整合

The sensing methodology can be applied to the situation required the analysis of force sensing or analog signal output,
Consumer electronics (analog user interface, micro joystick)
Robot, machine tool (surface receptor like finger, robot arm)
Medical devices (surgical micro gripper)
Smart shoes, smart cushion, smart bed (analysis of force distribution)