We proved that theoretical molar ratio of hydrogen can be produced by using recycling silicon (Kerf Loss) of semiconductor industry without surface or structure modification, and will focus on the surface and structure modification sector to increase the rate of hydrogen production, thus able to scale up with demand.

A method for generating hydrogen by chemical method and system are provided, which comprises: silicon powder and a catalyst; mixing the silicon powder and the catalyst in a reaction apparatus; and adding DI water into the reaction apparatus to chemically react with the silicon powder to generate hydrogen. The system comprises: a silicon powder supply device for the recovery of silicon powder from silicon waste slurry produced in the wafer dicing process and for supplying the silicon powder; a reaction apparatus for receiving the silicon powder and DI water to chemically react with the silicon powder to generate hydrogen; and a catalyst supply device for providing a catalyst composed of potassium hydroxide into the reaction apparatus. On the other hand, present technology also recover and purify the waste slurry generated by wafer cutting into a dry powder, and then react with water for hydrogen production at a specific temperature to produce hydrogen, and mix with additives such as KOH, Na2SiO3, H2SiO3 with specific formulations.The system is configured to solve the problem of silicon waste slurry and improve production rate and yield of hydrogen.

主要以製程上需要氫氣或熱電的廠商為主，並且本技術因應未來綠能減碳議題下，可以提供一完整高效率綠能製程，可廣泛應用在氣體業、發電業、製造業等