Non-conductive substrates are chemically modified by rGO. Hence, they can be directly electroplated. The rGO grafting process possesses many advantages, such as short process time, no chelator, no toxic agent, even it is a barrier layer for Cu diffusion. It is a wet process that has no organic solvent, which is environmental-friendlybeneficial for industrial production.

"◎Comparison with current technology
Non-conductive material (NCM) is metallized by ELS. ELS uses Pd as catalystHCHO as reducer, respectively. It produces H2 gasits waste water is difficult to treat.
◎Highlight of this work
NCM is modified by GO. The grafted GO is reduced to rGO without organic solvent. The rGO process has short process steps, low costeasy mass production capability

The specification of thermal reliability of chip stacking3D chip device become higherhigher. Graphene has outstanding heatmechanical properties. The rGO process uses water as solvent, so its toxicity is low. This technology can be applied to semiconductor, chip packaging, printed circuit board, heat dissipation devicenegative electrode of Li-ion battery.