Electroplated nanotwinned Cu possesses excellent electrical & mechanical properties. It can be applied in three major joints: 1. Low thermal budget/ low resistance Cu bonding for high performance computing chip. We are able to achieve low temperature bondinginstant bonding. Low temperature bonding is performed at 150°C for 1 h to achieve low contact resistance copper bonding. Instant bonding is performed at 300°C for 5 seconds under a pressure of 90MPa achieve low contact resistance. 2. High strength/ High ductility copper lines in 3D-IC packaging We are able to fabricate high strength foils with tensile strength of 800MPa. After annealing at 150°C for 3 hours, the foil retains a tensile strength of 750MPa. 3. Cu foils for lithium ion battery

These stimuli-switchable nanoparticles coated with the cleavable outer polymer coatingmultifunctional peptides may afford a new platform for anticancer drugmiR. These nanoparticles possess characteristics of environmental response, active targeting,gene/chemo combinatorial therapeutics, thus providing spatiotemporal control of posttranｓｃｒｉｐｔional gene regulation, smart nuclear/mitochondrial localization,simultaneous inhibition of multiple progression pathways of tumor cells for enhancing antitumor efficacysafety of cancer therapy.

HEMC firstly developed high entropy superalloys with excellent corrosion resistancehigh temperature strength, which are far superior to commonly used stainless steelgreat candidates for catalyst bed materials of hybrid rocket engine. For rocket nozzle, NA-1NA-2 advanced refractory alloys are developed according to the combustion condition of the rocket engine with the technology for designing refractory high entropy alloysthermodynamics-assisted phase diagram simulation software, which are expected to meet the needs for domestic rocket development.

Ninety percent of human diseases are related to abnormal inflammation. WJM team has successfully developed a new monoclonal antibody that can inhibit a key inflammation protein. Animal experiments have accumulated more than ten disease modes, including a variety of solid tumors, fibrosis, degenerativecardiovascular diseases. This antibody is qualified as an orphan drug for the treatment of IPF. New coronary pneumonia has greatly increased the demand for pulmonary fibrosis treatment,has also become an important target for mergersacquisitions of global pharmaceutical companies.

We grew p-GaN HEMT on a low-resistance SiC substrateadded a AlGaN cap layer above the p-GaN layer. We use the wide band gap material AlGaN as the cap layer, which can effectively suppress the holes injectionachieve the purpose of improving the gate reliability. In addition, we chose a zero-degree anglelow-resistance SiC substrate, which not only greatly reduces the lattice dislocation defects caused by the heterogeneous junction, but also greatly reduces the overall cost.

X-ray diffraction technology is used to analyze the drug efflux pump, ST50, form S. Typhi. The drug efflux mechanism for multiple drug resistant (MDR) S. Typhithe potential location for antigen of market-based typhoid detection reagent are understood through this ST50 structure. It could help develop the more effective typhoid detection reagentthe new antibiotics against MDR S. Typhi.

STT-MRAM: scaling down (submicron scale) along with issues of magnetic propertyintegration with semiconductor processing. SOT-MRAM: fundamental understanding on mechanism, integration with STT-MRAMCMOS for readout. VCMA-MRAM: understand the mechanism behind the observable VCMA phenomenon, integration with other RAMs for write/read.