Materials for power device packaging should endure high temperature, high voltage,high current density to handle various harsh working conditions. We developed Cu NP pasteCu/Sn paste for low temperature bonding technique. No toxic chemicals are present in the synthesis processin the pastes. The pastes can bond Cu substrates at low temperature without applying pressure. The joints possess high melting temperature, high thermal stabilityexcellent mechanical properties.

Current 5G communication devices have a huge demand in high resolutiondensity of metal conducting wires in electronics ( 40 μm line width/line spacing), which cannot be achieved by conventional screen printing (100 μm). Our group cooperated with Ample Technology to develop a new-generation silver conductive paste which enables photolithographyachieves outstanding line resolution (5 μm width/13 μm spacing). The paste is simple to useperforms comparable of those of major European, AmericanJapanese manufacturers.