Here we prepare a non-evaporative getter (NEG) film using magnetron sputtering. A vacuum chamber with a sputtered NEG film can maintain ultra-high vacuum (-10 Torr level) without any pump after activation. The activation temperature can be controlled below 200 °C according to different process conditions. The activated NEG film adsorbs residual gases in the vacuum system to achieve the UHV.

This technology develop a “Thermoelectric Ever-Charge Portable Charger” for the applications in auxiliary charging of consumer electronicsfast self-charging for outdoor sensors. Technically, a sputtering depositiona semiconductor photolithography technique are combined to fabricate p-n materialsconnection procedures. The thermoelectric performance of the device is further optimized through a low-temperature heat treatment.

Combined the advanced synchrotron beamline with the in-situ processing technologiesthe diversified measurement systems, we provide a parametrizable AI platform for material manufacturing processes, microstructures,product performance.

"Visible Light Communication (VLC)" is the best candidate for the next generation of network communication owing to its wide bandwidthscompatibility with solid-state lighting devices. Our proposed technology features a novel multilevel photosensing memory which can integrate the photosensing, memorycomputation components for VLC into one device. This device is based on a thin film transistor, where the oxide semiconductor is added with gold nanoparticles to form a "co-active layer" in order to expand the visible light sensing spectrumefficiently convert the light signal into a current signal. It not only simplifies the production processreduces the cost, but also accelerates the signal transmission speed, which further advances the future mobile comm

With rapid evolution of Moores lawsemiconductor technology nodes down to sub-10 nm, advanced devicematerial technologies capable of Å accuracy are highly demanded. Thus we developed atomic layer technologies including atomic layer deposition, atomic layer annealing, atomic layer epitaxy,atomic layer etching, etc. for extreme control of materialsstructures with Å precision.

This research develops an innovative method for patterning arbitrarycomplicated 3D microstructures on metallic roller surfaces. This roller mold manufacturing system consists of digital light processing, arrayed microlensesoptical fibers,precision servo-controlled motion technologies. Based on this arrayed UV beam pen system, seamless roller molds are fabricated for roller imprintin

The organic layerorganic-inorganic multi-layers deposited on the packaging substrate to achieve the ultra-high water barrier performance, lower than 10e-5 (g/m2/day). This technology can apply to all flexable electronic devices. The fabrication in this team evolved from batch-to-batch process in the 1st year to tray-to-tray process in the 3rd year. The roll-to-roll wet processin-line dry process are constructed in the 5th yearready for commercialization.

By combining the thermal evaporation and spin-coating techniques, we are able to demonstrate synthesis of 3 cm x 3 cm and 1.5 cm x 1.5 cm organometallic halide perovskite light-emitting diodes with electroluminescence at 538 nm and 405 nm, respectively. Other than the advantage in large device area, to our best knowledge, the demonstrated violet LEDs have produced the shortest emission wavelength available from current hybrid perovskites. The luminance of our green LEDs reach a maximum value of 9967 cd/m2 with an EQE of 0.88% and color purity of 95%. Moreover, it is possible to generate white light emission by combining the violet perovskite LEDs with visible light phosphor.

The location of controlled-grain Si island is determined by the pattern of “cooling holes”. The grain size is determined by the distance between “holes” due to lateral grain growth using pulse laser crystallization. This predictability allows the transistorscircuits to stay away from the grain boundaries for monolithic

Electroplated nanotwinned Cu possesses excellent electrical & mechanical properties. It can be applied in three major joints: 1. Low thermal budget/ low resistance Cu bonding for high performance computing chip. We are able to achieve low temperature bondinginstant bonding. Low temperature bonding is performed at 150°C for 1 h to achieve low contact resistance copper bonding. Instant bonding is performed at 300°C for 5 seconds under a pressure of 90MPa achieve low contact resistance. 2. High strength/ High ductility copper lines in 3D-IC packaging We are able to fabricate high strength foils with tensile strength of 800MPa. After annealing at 150°C for 3 hours, the foil retains a tensile strength of 750MPa. 3. Cu foils for lithium ion battery

Severe acute respiratory syndrome coronavirus 2 (SARS-CoV-2) infected human cell through ACE2. This study is developing a Pd nano-thin film electrode for electrochemical impedance spectroscopy. This invention can quantify neutralize antibody too. The detection platform can be used to screen 1 microliter anti-virus infection drug sample within 21 mins. Compare to SPR standard, our invention only needs 1/10000 concentration of ACE2reaction volume is ~1/30 than SPR. This invention can be adapted in detection of cancer markers,other emergency infection diseasestherapeutic drugs, too.