Technical Name Development and system integration of compound semiconductors and advanced packaging technologies
Project Operator National Cheng Kung University / Institute of Science Tokyo / Taiwan Semiconductor Research Institute, TSRI
Project Host N/A
Summary
To enhance the competitiveness of wide bandgap semiconductors (GaN and SiC) in Taiwan’s and Japan’s 5G/6G communications, automotive, and renewable energy sectors, the Academy of Innovative Semiconductor and Sustainable Manufacturing, in collaboration with Institute of Science Tokyo, is leading an integrated development plan. This initiative unites academia, industry, and research institutions from both Taiwan and Japan to strengthen their global semiconductor positions and develop future talent. By closely collaborating, the teams from Taiwan and Japan will optimize device performance and packaging solutions, aiming to position both countries as leaders in these critical technologies.
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  • Zi-Hao Wang
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