Technical Name Large-area, high-efficiency, CMOS-compatible metalenses
Project Operator National Yang Ming Chiao Tung University (NYCU)
Project Host 余沛慈
Summary
We successfully use low-cost photolithography with standard CMOS processes to fabricate 332 high-efficiency near-infraredvisible metalenses with 8 mm diameter on an 8-inch glass substrate. Each metalens contains over 70 million nanostructuresachieves a conversion efficiency close to the diffraction limit. Our technology enables mass-producing metasurfacesmetalenses at low costallows the integration of opticalelectronic components in miniature CMOS image/depth sensors.
Scientific Breakthrough
This work presents large-area near-infraredvisible metalenses produced with today’s semiconductor CMOS processes. Through low-cost photolithographyresolution enhancement technology, we can precisely control the dimensions of nanopillars in the metalens to achieve diffraction-limited focusing with high efficiency. The work will enable the integration of metalensmetasurfaces into CMOS sensors, allowing versatile optoelectronic componentssystems in a miniature form.
Industrial Applicability
The rise of the metaverse in recent years has driven the development of wearable devices related to virtual reality (VR)augmented reality (AR). Metasurfacesmetalenses that can manipulate electromagnetic waves in a very small form factor have shown promising potential to replace traditional optical components for metaverse applications. The CMOS-compatible processes further permit the integration of opticalelectronic components in tiny IC chipssensors.
Keyword Metalens Metasurface Photolithography mass-production optical proximity correction deep learning metaverse augmented reality virtual reality mixed reality
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