The results of the preliminary study for the heat transfer of single cylinder with a slit show that the slit does increase the local heat transfer coefficient (Nu) and the average heat transfer coefficient of the surface. Therefore, the slit is an effective method to enhance the heat transfer of the cylinder. The objects in this research project are the flow structure and heat transfer rate of cylindrical arrays at different pitches and staggered angles, the interaction mechanism and relationship between flow structure and heat transfer of cylindrical arrays, and the change of flow structure and heat transfer by slit to improve the heat transfer of the cylindrical array. The heat transfer optimization is based on the Entropy Generation Minimization (EGM) method to obtain the cylindrical pitch and stagger angle and the slit width and the slit inclination angle which are most favorable to heat transfer.

This technique is to improve the original needle-shaped pin fin slit, the best slit angle is obtained from the simulation results, change its wake pattern to increase the thermal heat rate per unit area, improve the overall heat transfer coefficient. The simulation results show that compared with the original design, the gain cooling rate is 10 to 15%, which greatly improves the cooling capacity and reduces the cooling fan operating time.

Cooling is very important for the electronics industry, because electronic products through the current will produce residual heat, if the residual heat cannot be successfully discharged easily caused by the component overheating damage. This work will be applied in other fields in the future, such as: AI cloud database, medical equipment, processing tool machine, water cycle cooling, electronic components cooling and other industries and fields with a large number of thermal demand, but still need to overcome the various industries, for their own thermal demand and use of places, uses and other conditions.