| Technical Name | High Precision Maskless Lithography System for Advanced IC Substrates and Packaging | ||
|---|---|---|---|
| Project Operator | Engineering & Technology Promotion Center | ||
| Summary | This project develops a high-precision maskless lithography system consists of digital light processing, microlens / spatial filters arrays, and precision servo-controlled motion technologies. Based on this maskless UV lithographic system, we are able to achieve UV patterning of arbitrary and complicated 2D/3D microstructures for advanced IC substrate and packaging. |
||
| Scientific Breakthrough | 已經獲得：台灣、美國、中國大陸三個地區的專利 |
||
| Industrial Applicability | This maskless UV lithographic technology is particular important for large-area substrate demanding complex patterns with smaller (~10 um) feature sizes. It also has the flexibility for making three dimensional microstructure profiles on planar substrates. |
||
other people also saw
