Technical Name Microchannel Cooling Technology and Module
Project Operator National Chung-Shan Insitute of Science and Technology
Summary
Novel microchannel structure and heat sink having the same.
We have demonstrated 3 bars MCC stack(pumping source) which have power densities ~600 W/cm2 when operating at 80W /bar .
Scientific Breakthrough
The present invention relates to the technology field of heat sinks, and more particularly to a novel microchannel structure and a heat sink having the same.
The present invention mainly provides a novel microchannel structure comprising a plurality of first fluid-guiding channels, a plurality of micro fluid-guiding channels and a plurality of second fluid-guiding channels. Particularly, the first fluid-guiding channel has an arc-shaped fluid-guiding end corner communicating with a first channel opening of the micro fluid-guiding channel, and the second fluid-guiding channel has an arc-shaped fluid-guiding start corner communicating with a second channel opening of the micro fluid-guiding channel. Therefore, when a refrigerant fluid flows in the heat sink, the flow speed of the refrigerant fluid would be changed because the cross sectional area of an U-shaped fluid-guiding channel constructed by the arc-shaped fluid-guiding end corner, the micro fluid-guiding channel and the arc-shaped fluid-guiding start corner varies along the flow direction of the refrigerant fluid, such that the heat dissipating ability of the heat sink is enhanced without increasing the power of circulation pump.
Listing of the CLAIMS:
A novel microchannel structure, being applied in a heat sink comprising an inlet
layer, a communication layer and an outlet layer stacked to each other; wherein the inlet layer and the outlet layer are provided with a first flow groove and a second flow groove thereon, respectively;
wherein the said novel microchannel structure comprises a plurality of micro fluid-guiding channels disposed in the communication layer; moreover, each of the plurality micro fluid-guiding channels having a first channel opening and a second channel opening, and the diameter size of the first channel opening being not equal to the diameter size of the second channel opening;
wherein the first channel opening and the second channel opening are respectively connected to the first flow groove and the second flow groove, such that a refrigerant fluid in the first flow groove is able to flow into the second flow groove through each of the plurality micro fluid-guiding channel;
wherein each of the plurality micro fluid-guiding channel is an oval-shaped channel, and the diameter size of the first channel opening being greater or smaller than the diameter size of the second channel opening.
wherein each of the plurality micro fluid-guiding channel comprises a cylinder channel and a conical channel, and the diameter size of the first channel opening being greater or smaller than the diameter size of the second channel opening.

Technology specification:
Cooling capacity: >=200 W/cm2
Typical coolant pressure:120~150 kPa
Flow rate per bar:500 ~600 l/min
3 bars MCC stack pressure drop: 270~300 kPa
3 bars MCC stack flow rate:1500 l/min
Industrial Applicability
雙邊Pumping Source增益平板導波管散熱及3D堆疊晶片模組的微流道冷卻系統、燃料電池微流道及生物晶片。
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