| Technical Name | Fabrication of high conductivity base metallow ohmic alloy resistor | ||
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| Project Operator | National Cheng Kung University | ||
| Project Host | 李文熙 | ||
| Summary | A novel method for fabricating the base metalalloy electrode such Cu, Ni,CuNi in air atmosphere for high temperature firing has successfully developed based on thick film screen printing Al pastesreduction-oxidation substitution reaction |
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| Scientific Breakthrough | The first thick film screen printing Cu electrode with high conductivity ( 10-6 Ω), which is comparable to thick film Ag electrode has been successfully made in air firing instead of reducing atmosphere firing. |
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| Industrial Applicability | In order to reduce the Al paste consumption as using just screen-printing Al finger grid on the rear side, Cu electrodes are substituted for both sides of Al electrodes to prevent power loss of module by double side generating electricity,operating in lower temperature. The best efficiency of p-type bifacial PERC solar cell with Cu electrodes can reach 23.2 |
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| Keyword | Thick film screen printing reduction-oxidation substitution base metal base alloy back electrode for solar cell bifacial solar cell front electrode for solar cell thick film Cu paste thick film Al paste thick film Ag paste | ||
- leewen@mail.ncku.edu.tw
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