Technical Name | ChipsSubsystems for the Next-Generation Communication System over mm-Wave Bands | ||
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Project Operator | National Applied Research Labroratories | ||
Project Host | - | ||
Summary | "The demonstrated technologies include: (1) 38GHz millimeter-wave CMOS transmitreceive integrated circuits using CMOS technology to realize the low-power transmittersreceivers required for the future millimeter-wave communications (2) Millimeter wave array antenna (3) High-performance radio frequency front-end key components based on GaAs semiconductor process technology over millimete |
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Scientific Breakthrough | - |
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Industrial Applicability | - |
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Keyword |